EAS Newsletter

Our Current Topics

Our newsletter is published 4 times a year. It informs about new developments, projects or events of the EAS Division.


Peter Schneider appointed as a professor at TU Dresden (University of Technology)

On March 1, 2023, Professor Peter Schneider became Professor of Design Methodology for Adaptive Microelectronic Systems at the Institute of Electromechanical and Electronic Design (IFTE) of Technische Universität Dresden (TUD).


#Knowledge compact. A visit to the electronics lab

Watch the latest installment in our short video series and join our scientists in their labs to discover more about their work and our lab facilities. The third video in the series features a visit to the electronics lab with Marcel Jotschke. 


Energy management for greater sustainability in buildings

In order to be able to use and maintain existing technology such as heat pumps and the like effectively, intelligent sensor technology is needed that can contribute to greater efficiency of an installation when used proactively. This is what we are working on in the SHANGO project together with other experts from research and industry.


#EAS voices. Aging circuits: A growing challenge for the semiconductor industry

With an increasing number of possible applications and the growing complexity of integrated circuits (ICs), the challenge of maintaining their reliability and longevity is also rising. André Lange explains approaches how the semiconductor industry can meet these challenges.


Digitization 2.0 – integration of data sources for process optimization by artificial intelligence

Our expert Dirk Mayer explains in an interview how data sources can be integrated for industrial process optimization using artificial intelligence. Furthermore, you will get an insight into the offers of our new Application and Test Center AI.


Our future events and dates

2023 started again for our colleagues many trade shows and conferences in presence. We give you a review of Embedded World 2023 with trends and developments in microelectronics.

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