Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS
Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS
Newsletter Fraunhofer IIS/EAS
© MEV-Verlag, Germany
Newsletter Fraunhoer IIS/EAS

Media & Press#

© MEV-Verlag, Germany

EAS Newsletter

Our Current Topics#

Our newsletter is published 4 times a year. It informs about new developments, projects or events of the EAS Division.

 

© KEX AG

Identifying the right AI use cases with the “AI Navigator”

KEX AG and Fraunhofer IIS/EAS have joined forces to create the “AI Navigator.” Their goal is to provide companies with a tool that will help them find the optimal route to successfully and profitably deploying AI technologies.

Read more on the AI Navigator
 

© Volker Mai / Fraunhofer IZM

High tech for SMEs

In collaboration with Globalfoundries Dresden, an alliance of Fraunhofer Institutes in Saxony has developed a sensor platform that can be used to create individually configurable IoT and edge computing solutions. For small and medium-sized enterprises, the platform represents an unprecedented opportunity to cost-effectively produce exceptionally powerful, energy-efficient, and highly integrated systems.

Read more on USeP
 

#EAS Voices: Solving the chip shortage with chiplets

Whereas high-volume chip orders are likely to recover from the recent supply bottlenecks relatively quickly, companies looking to purchase ICs on a small or medium scale face the prospect of an uphill struggle. Our expert Andy Heinig examines a potential solution for this problem.

Read more on chiplets
 

© sdecoret / Fotolia.com

New consortium project on AI ready for launch

In the consortium project “Artificial Intelligence: Understand – Apply – Benefit,” participants from a wide range of fields learn how to harness the potential of AI. The applications covered range from production processes or operational workflows to integration in products and services. The one-year project will begin on June 25, 2021. Late registration is possible.

Read more on the AI consortium project
 

© pickup - stock.adobe.com | INC Invention Center

Technology and innovation management for a sustainable future

In collaboration with Fraunhofer IIS/EAS, the INC Invention Center will host the “Technology and Innovation Summit” on June 23 and 24. The digital event will feature prominent experts from industry and research who will present the latest trends and topics, as well as practical examples in the highly topical fields of AI, Industry 4.0, and the hydrogen economy.

Read more on TIS 2021

Our Future Events and Dates

Upcoming Events 2020

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