Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS
Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS
Newsletter Fraunhofer IIS/EAS
© MEV-Verlag, Germany
Newsletter Fraunhoer IIS/EAS

Media & Press

© MEV-Verlag, Germany

EAS Newsletter

Our Current Topics

Our newsletter is published 4 times a year. It informs about new developments, projects or events of the EAS Division.

 

© Fraunhofer IIS/EAS, Foto: Arvid Müller

A new building for applied microelectronics research

Almost exactly four years after ground was broken, Fraunhofer IIS/EAS officially opened its new institute building on June 30, 2022. Saxony’s Minister President Michael Kretschmer, Saxony’s State Minister of Science, Culture and Tourism Sebastian Gemkow and the President of the Fraunhofer-Gesellschaft, Professor Reimund Neugebauer, inaugurated the new building.

Read more on the event
 

© sdecoret / Fotolia.com

Join the fourth AI consortium project

The third consortium project, in which the INC Invention Center and Fraunhofer IIS/EAS help companies get ready to use artificial intelligence, is still ongoing, but preparations for the next project in this successful series are already underway. In the “AI: Understand – Apply – Benefit” consortium project, participants from a wide range of industries learn how to harness the potential of AI to their advantage.

Read more on the project
 

© Fraunhofer IIS/EAS, Foto: BLEND3 Frank Grätz

From our research: Successful quantum-safe data transfer

A new application center for the practical application of quantum communication has been launched at the Fraunhofer IIS/EAS location in Dresden. This technology is considered a pioneering way to ensure data transfer remains tap-proof in the event of future hacker attacks.

Read more on the center
 

A virtual world of innovation in micro- and nanoelectronics

Starting now, an interactive world invites anyone interested in the technologies that we and our research partners focus on at the High-Performance Center Mikronano to take a virtual tour of some of our work and developments.

Read more on the showroom
 

#EAS voices: Chiplets – current status

New products demonstrate that even large and complex chiplet structures can be made reliable and efficient. Our chiplet expert Andy Heinig presents current developments and trends, for example when it comes to reusing particular circuits.

Read more on current chiplet developments

Our Future Events and Dates

Upcoming Events 2020

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