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EAS Newsletter

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Our newsletter is published 4 times a year. It informs about new developments, projects or events of the EAS Division.


Proof Provided

With the help of Fraunhofer IIS/EAS, the international semiconductor manufacturer LFoundry is preparing its 150 nm technology to support applications that are especially safety critical. Thanks to their joint work, in the future it will be possible for the first time to make a more precise forecast about the overall reliability of an integrated circuit in this technology before it is used in practice. As a result, the applications of European microelectronics will be significantly expanded in areas such as the automotive sector.


FDSOI will become the key for European industry

THINGS2DO is a European joint project with over 40 partners,12 of whom are in Germany and have contributed particularly intensively in order to jointly create the design principles for the new FDSOI-based 22FDX technology. The objective of the project was to give European industry access to the new FDSOI semiconductor technology.


Innovation cluster for sensory technology in Saxony (SenSa) founded

The kick-off for the innovation cluster for sensory technology in Saxony “SenSa” took place in Dresden.

Our Future Events and Dates

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