EAS Newsletter

Our Current Topics

Our newsletter is published 4 times a year. It informs about new developments, projects or events of the Engineering of Adaptive Systems Division.

 

7th Chiplet Center of Excellence (CCoE) Industry Workshop

At the 7th Industry Workshop of the Chiplet Center of Excellence (CCoE) in Dresden, industry partners exchanged insights on the latest advancements and emerging applications of chiplet technologies. The focus was on the collaborative development of modular, scalable systems, with the clear goal of accelerating the transfer of innovative approaches into industrial practice.

 

embedded world 2026 Recap – What’s Driving the Microelectronics Industry Today

Current trends, technically sound insights, and individual impressions from embedded world 2026: In this interview, our experts share key insights into the latest questions from industry and business, as well as the inspiration they gained for further research into specific questions.

 

APECS pilot line – Focus on the European chip initiative

In early March at the Dresden site, we offered insights into our work within the APECS pilot line – a European platform intended to accelerate the transfer of innovations from the world of research into industrial applications. A visit by high-ranking European representatives highlighted the importance of collaboration, new approaches and practical developments for the future of microelectronics.

 

Affordable sensor technology for permanent infrastructure monitoring

Germany is facing a growing challenge: Many bridges, railroads, and structures are deteriorating – but continual monitoring has so far been laborious and expensive. With this in mind, we are taking an innovative approach involving the use of robust radar sensor technology from the automotive sector. 

 

Highlights of 2025 – Demo production environment in Dresden

The latest Annual Report from Fraunhofer IIS shows how innovations are put into practice – and the highlights of 2025 include the demo production environment at our Dresden site. In this realistic test environment, companies can test AI applications across an entire production process – from sensor technology to robotic assembly and a digital twin.

 

»Wissenssnacks«: technical knowhow in bite-size, 30-minute sessions

Keep up to date despite a busy working life: On Wednesdays from 11:30 a.m. to 12:00 p.m., our »Wissenssnacks« sessions offer bite-sized insights into the latest topics from industry, digitization, and AI. In just 30 minutes, you’ll gain practical insights into everything from edge devices to digital twins, IT/OT security, and AI applications in production.

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