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EAS Newsletter

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Our newsletter is published 4 times a year. It informs about new developments, projects or events of the EAS Division.

 

AI Innovation Days 2020

The AI Innovation Days on September 16 and 17, 2020 are being staged as a combination of live event and virtual event, offering companies comprehensive insights into numerous facets of AI in applications for Saxony. Successful AI actors and premium speakers share their expertise, best practice examples and strategic considerations with the event participants.

 

 

 

Saxony consortium project “AI: understand – apply – benefit”

Fraunhofer IIS/EAS is joining forces with KEX Knowledge Exchange AG to support AI users with a broad portfolio of measures as they further develop their expertise in the field of artificial intelligence. The project start will be at the AI Innovation Days.

 

#EAS Voices. Packaging and package design for AI at the edge

Our expert Andy Heinig about the package design for AI at the edge and why system architects need to be able to compare different design variants at an early stage with a high level of abstraction.

 

In brief. What is automated analog design?

Benjamin Prautsch, Group Manager Mixed-Signal Automation at Fraunhofer IIS/EAS, explains why it is less expensive and more effective to use an automated design approach for developing analog components – even on AI hardware.

 

From our research: Manufacturing technologies for 3 nm semiconductor technology

The next generation of highly integrated microelectronics calls for the development of new manufacturing technologies. To this end, the PIN3S project will develop procedures and have them interact to produce ICs with channel lengths of 3 nanometers.

 

 

Our Future Events and Dates

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