EAS Newsletter

Our Current Topics

Our newsletter is published 4 times a year. It informs about new developments, projects or events of the EAS Division.

 

A new building for applied microelectronics research

Almost exactly four years after ground was broken, Fraunhofer IIS/EAS officially opened its new institute building on June 30, 2022. Saxony’s Minister President Michael Kretschmer, Saxony’s State Minister of Science, Culture and Tourism Sebastian Gemkow and the President of the Fraunhofer-Gesellschaft, Professor Reimund Neugebauer, inaugurated the new building.

 

Join the fourth AI consortium project

The third consortium project, in which the INC Invention Center and Fraunhofer IIS/EAS help companies get ready to use artificial intelligence, is still ongoing, but preparations for the next project in this successful series are already underway. In the “AI: Understand – Apply – Benefit” consortium project, participants from a wide range of industries learn how to harness the potential of AI to their advantage.

 

From our research: Successful quantum-safe data transfer

A new application center for the practical application of quantum communication has been launched at the Fraunhofer IIS/EAS location in Dresden. This technology is considered a pioneering way to ensure data transfer remains tap-proof in the event of future hacker attacks.

 

A virtual world of innovation in micro- and nanoelectronics

Starting now, an interactive world invites anyone interested in the technologies that we and our research partners focus on at the High-Performance Center Mikronano to take a virtual tour of some of our work and developments.

 

#EAS voices: Chiplets – current status

New products demonstrate that even large and complex chiplet structures can be made reliable and efficient. Our chiplet expert Andy Heinig presents current developments and trends, for example when it comes to reusing particular circuits.

Our Future Events and Dates

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