EAS Newsletter

Our Current Topics

Our newsletter is published 4 times a year. It informs about new developments, projects or events of the EAS Division.

 

First chiplet project implemented in 5-nm technology by Samsung

Fraunhofer IIS/EAS has implemented its first chiplet interface IP project on Samsung’s 5 nm technology. This work marks a first step in supporting the swift introduction of chiplet technology on a global scale – even for electronics produced in small batch sizes.

 

#Knowledge compact. A visit to the vehicle lab

Watch the latest installment in our short video series and join our scientists in their labs to discover more about their work and our lab facilities. The second video in the series features a visit to the vehicle lab with Dr. Roland Jancke.

 

Help shape the AI Application and Test Center

Applying artificial intelligence is a fundamental part of digitalizing processes used in industry and society. The AI Application and Test Center, which is currently being established at Fraunhofer IIS/EAS in Dresden, will address the particular challenges facing small and medium enterprises (SMEs). André Kostov gives you an overview about it.

 

#EAS voices. Microelectronics for quantum technology

Our experts Dr. Kay-Uwe Giering and Andy Heinig shed light on how to set up a quantum system interface in the outside world.

 

Our new webinar program

We are familiar with the challenges companies are currently facing. In our webinars, we take a look at these topics and cover the latest developments in a compact format that can be accessed free of charge. We also share details of the results of our work and how these can be applied. The new webinar program for the first half of 2023 is available online now.

Our Future Events and Dates

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