Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive SystemsDeveloping outstanding products and services for our customers, initiating groundbreaking research projects, and building a more sustainable world are objectives that Fraunhofer IIS pursued intensively last year. The Fraunhofer IIS Annual Report provides insights into our wide-ranging activities.
Fraunhofer IIS Annual Report 2024: fascinating insights into our work
Highlight project 2024 of the Dresden division: Chiplets for the semiconductor industry of the future
Elektroniklabore des Fraunhofer IIS Dresden
Fraunhofer IIS - Labor Advanced Packaging
Demands on microchip performance, such as for AI applications, are constantly increasing, along with the pressure for those microchips to remain cost-effective. With conventional chip design currently reaching its limits, chiplets promise a viable solution for the future. Thanks to their innovative design, multiple small circuits – each manufactured using the most suitable manufacturing technology – can be combined like building blocks. This optimizes the overall system and makes it possible to create new, more efficient systems in less time, ultimately saving development time and costs. We are working closely with industry partners to advance chiplet technology in Europe. We optimize these modular systems with innovative architectures while also researching the interfaces between chiplets and the power supply.
Together with Fraunhofer IZM and Fraunhofer ENAS, we have founded the pioneering Chiplet Center of Excellence initiative, set up as a research partnership with industry stakeholders. The Center brings together experts from design, tooling, technology, and application across the automotive value chain to ensure the rapid industrialization of chiplet technology. All participants in the initiative share the goal of assessing the feasibility of chiplet-based system solutions at an early stage. In addition, Engineering of Adaptive Systems is working together with the Smart Sensing and Electronics division on a reference platform for chiplets. It’s also leading a work package for the pan-European project Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) where we contribute our design and testing expertise to chiplet development.
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- Further research highlights at Fraunhofer IIS in 2024 (iis.fraunhofer.de)