Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS
Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS

Media & Press

Scientific Publications in Fraunhofer Publica

The »Fraunhofer-Publica« is a publication database of the Fraunhofer Gesellschaft. It contains the scientific publications and patents from the institutes.

Conference contributions and proceedings as well as articles and university papers by employees of the EAS Division are also registered here. Electronically available documents can be downloaded as full text directly from the database. For other publications, the reference sources are cited.

Scientific Publications 2020

You can search here for the publications of our scientists in 2020.

YearTitle/AuthorDocument Type
2020A 10.5 μW programmable SAR ADC Frontend with SC Preamplifier for Low-Power IoT Sensor Nodes: Paper presented at IEEE 6th Virtual World Forum on Internet of Things, WF-IoT 2020, 2-6 June 2020
Jotschke, Marcel; Carvajal Ossa, Wilmar; Reich, Torsten; Mayr, Christian		Conference Paper
202013-Gb/s Transmitter for Bunch of Wires Chip-to-Chip Interface Standard
Chaudhary, Muhammad Waqas; Heinig, Andy; Choubey, Bhaskar		Conference Paper
2020Artifical Intelligence for sustainable and energy efficient buildings: Presentation held at EPoSS and EPSI Annual Forum 2020, Digital Conference, September 29-30, 2020
Mayer, Dirk; Enge-Rosenblatt, Olaf; Haufe, Jürgen; Wilde, Andreas; Seidel, Stephan		Presentation
2020Artificial Intelligence for Industrial Applications: Redaktionell betreuter Blogbeitrag auf https://semiengineering.com, 13.02.2020
Mayer, Dirk; Enge-Rosenblatt, Olaf		Electronic Publication
2020Co-Design für System-in-Package-on Board: Management von Komplexität und Entwurfslandschaft zur Erarbeitung kompakter 3D Systemlösungen, Teilvorhaben: Designmethoden und Designflows für das System-in-Package-on-Board Co-Design. Abschlussbericht: Projektlaufzeit: 01.03.2016 bis 28.02.2019
Heinig, Andy		Report
2020cSoC­3D - Echtzeitfähige 3D­-Datenverarbeitung auf kaskadierten analog-­digital customized System on a Chip (cSoC)-­Architekturen. Teilvorhaben: cVSoC­3D - "Customized Vision System on Chip for 3D Processing": Projektlaufzeit: 01.05.2016 bis 31.12.2019
Döge, Jens; Hoppe, C.		Report
2020Design of a Reference Source with Ultra-Low Power Consumption in 180 nm SOI Technology
Palanisamy, Gokulkumar; Teixeira, Viviane Silva (Betreuer); Carvajal Ossa, Wilmar 		Master Thesis
2020Design of an ultra-low-power current steering DAC in a modern SOI technology
Venkatesha, Shishira Subbarao; Lienig, Jens; Koh, Jeongwook 		Master Thesis
2020Digital Twins in Automotive: Redaktionell betreuter Blogbeitrag auf https://semiengineering.com, 16.01.2020
Jancke, Roland		Electronic Publication
2020Entwicklung eines Standards für ein elektronisches Datenformat zur Beschreibung von Mission Profiles: Poster präsentiert beim edaWorkshop 2020, 7. und 8. Oktober 2020, Online-Workshop
Sohrmann, Christoph		Poster
2020Formation of multiple current filaments and the effect of filament confinement in silicon based PIN diodes
Scharf, Patrick; Sohrmann, Christoph		Conference Paper
2020Introducing a Reference Flow for Chip-Package Co-Design for 5G / MM-Wave Designs on GF ADK for 22FDX: Presentation held at Cadence Live Europe 2020, Virtual Event, October 13-14, 2020
Heinig, Andy; Hopsch, Fabian		Presentation
2020Kostenoptimale Steuerung eines multivalenten Gebäudeenergiesystems mittels modellprädiktivem Ansatz und Reinforcement Learning
Huang, Chenzi; Seidel, Stephan; Velarde Gonzales, Fabio Alberto; Mayer, Dirk		Conference Paper
2020Layout Generators for Artificial Intelligence Hardware Design: Redaktionell betreuter Blogbeitrag auf https://semiengineering.com, 14.05.2020
Prautsch, Benjamin		Electronic Publication
2020Machine Learning-Based Unbalance Detection of a Rotating Shaft Using Vibration Data
Mey, Oliver; Neudeck, Willi; Schneider, André; Enge-Rosenblatt, Olaf		Conference Paper
2020Packaging and Package Design for AI at the Edge: Redaktionell betreuter Blogbeitrag auf https://semiengineering.com, March 12th, 2020
Heinig, Andy		Electronic Publication
2020PEM-Identification of a block-oriented nonlinear stochastic model with application to room temperature modeling
Paschke, Fabian		Conference Paper
2020Sehen, Verstehen und Reagieren mit tausenden Bildern pro Sekunde: Vortrag gehalten bei Science meets Industry, 4. März 2020, Freiberg
Döge, Jens		Presentation
2020Simulationsszenarien für Gebäudeenergiesimulation in frühen Planungsphasen
Eckstädt, Elisabeth; Paepcke, Anne; Hentschel, Alexander; Schneider, André; Nicolai, Andreas		Conference Paper
2020A Summary of Piezoelectric Energy Harvesting for Autonomous Smart Structures
Grasböck, Lukas; Reininger, Alexander; Nader, Manfred; Humer, Alexander; Schagerl, Martin; Misol, Malte; Monner, Hans Peter; Herold, Sven; Mayer, Dirk		Conference Paper
2020TAPEOUT-IN-TIME GEHT NICHT? DOCH! IIP Generatoren für Design und Reuse von Analogen ICs: Poster präsentiert bei Science Meets Industry, 04. März 2020, Freiberg
Prautsch, Benjamin		Poster
2020Thermal On-Board Spectroscopy: Thermal Impedance Simulation Using FEM and Thermal Modelling
Khatib, Mohamad el; Reitz, Sven; Warmuth, Jens		Conference Paper
2020Trustworthy Electronics: Redaktionell betreuter Blogbeitrag auf https://semiengineering.com, June 11th, 2020
Jancke, Roland		Electronic Publication
2020Ultra-Low PoweR TechnologIes and MEmory architectures for IoT: EU-Verbundprojekt im Rahmen HORIZON2020 Initiative ECSEL, Projekt Akronym "PRIME"; Laufzeit des Vorhabens: 01.05-2016 - 30.09.2019
Seidel, Konrad; Eichler, Uwe		Report
2020What's Holding Back Aging Simulation?: Redaktionell betreuter Blogbeitrag auf https://semiengineering.com, April 9th, 2020
Lange, André		Electronic Publication
This publication list has been generated from the publication database Fraunhofer-Publica.