News vom Fraunhofer IIS/EAS

Maintaining wind turbines and identifying potential vulnerabilities is expensive and time-consuming, especially when they are located offshore. As a result, rotor blades are often simply replaced, a costly process, when damage is merely suspected. The Fraunhofer Institute for Integrated Circuits IIS, working in concert with the Fraunhofer Institute for Wind Energy Systems IWES, has developed a solution that can be used to identify cracks and breakage inside the blades remotely at an early stage.

On March 31, 2025, at the Hannover Messe, the Research Fab Microelectronics Germany officially unveiled its new Chiplet Application Hub. 

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semi-conductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act.