Media & Press

News vom Fraunhofer IIS/EAS

Our Newsletter

Stay in touch and learn more about new developments, research projects or events of Fraunhofer IIS/EAS.

Information Sheets

Annual Report

A profile of the Fraunhofer Institute for Integrated Circuits IIS with numerous dates and facts as well as outstanding projects of a year.

 

Scientific Publications

Among others, you can find in the database »Fraunhofer-Publica« scientific publications, conference contributions and proceedings from the Fraunhofer institutes.

Current Press Releases (Selection)

 

Press Release / 10.4.2019

Globalfoundries, Fraunhofer and Next Big Thing found start-up

Sensry enables small and medium-sized businesses to gain access to innovative semiconductor technologies based on GLOBALFOUNDRIES 22FDX technology. Thus it enables the problem-free use of trend-setting system architectures and manufacturing methods also for prototypes and small series in connection with most modern assembly and packaging technologies.

 

Press Release / 7.12.2018

Proof provided

With the help of Fraunhofer IIS/EAS, the international semiconductor manufacturer LFoundry is preparing its 150 nm technology to support applications that are especially safety critical. Thanks to their joint work, in the future it will be possible for the first time to make a more precise forecast about the overall reliability of an integrated circuit in this technology before it is used in practice. As a result, the applications of European microelectronics will be significantly expanded in areas such as the automotive sector.

 

Joint Press Release by the partners of the project "RESIST" / 15.5.2018

Trailblazer for Especially Robust Vehicle Electronics

The partners in the research project "RESIST" have spent the last three years working on new approaches to the development of resilient electronic systems. Their results contribute to the next generation of especially fail-safe vehicle electronics to meet the highest quality, safety and performance standards.