News vom Fraunhofer IIS/EAS

Our Newsletter

Stay in touch and learn more about new developments, research projects or events of Fraunhofer IIS/EAS.

Information Sheets

Annual Report

A profile of the Fraunhofer Institute for Integrated Circuits IIS with numerous dates and facts as well as outstanding projects of a year.


Scientific Publications

Among others, you can find in the database »Fraunhofer-Publica« scientific publications, conference contributions and proceedings from the Fraunhofer institutes.

Current Press Releases (Selection)


Press Release / Nov. 10, 2022

Chiplet Project in 5 nm Process Technology from Samsung

Fraunhofer IIS/EAS has announced today their first implementation of the Bunch of Wires (BoW) standard-based interface IP from the Open Compute Project (OCP) on Samsung’s 5 nm technology. This work represents a first step towards supporting the rapid introduction of chiplet technology, even enabling electronic products with smaller production runs.


Press Release / 18.8.2022

Silicon Measurements for International Collaboration Project

Fraunhofer IIS/EAS performed silicon measurements and lab testing for a design that Cadence Design Systems, Inc. and GlobalFoundries collaborated on to accelerate 5G and mobile design innovation. As a proof point, the Cadence full-flow RF solution was used to design and tape out a 28GHz 5G mmWave IC as a complete system-in-package (SiP) solution.


Press Release / 20.10.2020

Decentralized monitoring of COVID-19 patients

M³Infekt, a Fraunhofer cluster project, aims to develop a monitoring system that enables early intervention in the event that a patient’s condition suddenly starts to deteriorate. It will be a modular, multimodal and mobile system, and will also be suitable for use in the treatment of COVID-19 patients.