News vom Fraunhofer IIS/EAS

Fraunhofer IIS/EAS has announced today their first implementation of the Bunch of Wires (BoW) standard-based interface IP from the Open Compute Project (OCP) on Samsung’s 5 nm technology. This work represents a first step towards supporting the rapid introduction of chiplet technology, even enabling electronic products with smaller production runs.

Fraunhofer IIS/EAS performed silicon measurements and lab testing for a design that Cadence Design Systems, Inc. and GlobalFoundries collaborated on to accelerate 5G and mobile design innovation. As a proof point, the Cadence full-flow RF solution was used to design and tape out a 28GHz 5G mmWave IC as a complete system-in-package (SiP) solution.

M³Infekt, a Fraunhofer cluster project, aims to develop a monitoring system that enables early intervention in the event that a patient’s condition suddenly starts to deteriorate. It will be a modular, multimodal and mobile system, and will also be suitable for use in the treatment of COVID-19 patients.