Information Material on the Business Area Design Methodology

 

Reliability and Life Cycle Prediction

The rapid technological progress in the development of electronic components and products requires new strategies during the design process. Constraints such as reliability, durability, cost efficiency and miniaturization are huge challenges for deverlopers and engineers nowadays. Fraunhofer IIS/EAS offers a wide range of products and services to support the circuit design processes.
 

HeatVision – The Thermal View of Your Design

Growing integration density and complexity of integrated circuits increasingly exacerbate the difficulty of predicting electro-thermal interactions in design. Nevertheless, the designer must recognize resulting violations of specifications in time. For this reason the HeatVision software tool developed by Fraunhofer IIS/EAS offers complete control of your design's thermal conditions.