Key Issue Microelectronics

We support our customers in the use of advanced technologies, processes and methods in the development and application of microelectronics. Our work therefore aims to address the continual downsizing of semiconductor devices and the growing complexity of electronic systems using new design concepts. Another focus is on new design technologies and solution concepts based on the "More than Moore" approach. In all areas, the goal of our work is to ensure fast, faultless and reliable development of electronic systems.

Our mission is to offer electronics designers assistance in the design process and provide them with innovative tools and services so that they can meet the current and future challenges in IC design and produce long-lasting, functionally safe products.

Reference Projects

PRIME

Future technical solutions in the Internet of Things are subject to especially high requirements for energy-efficient, small and inexpensive components. The "PRIME" project is establishing the prerequisites for the required manufacturing technologies in Germany and Europe.

 

ADMONT

Combining expertise, technological platforms and existing clean rooms, a unique design center for »More-than-Moore-Technologien« is developed in Dresden.

THINGS2DO

An increasing number of applications call for more powerful and more individually customized technologies. In response, the project "THINGS2DO" is focused on the development of a virtual German design center for FD-SOI components.

MoRV

The MoRV project aimed to develop software that ensures already during the IC design phase that the ICs developed will have the desired operating properties.

SiPoB-3D

The scientists at Fraunhofer IIS/EAS are working in this project on design methods and design flows for the so-called system-package-board co-design. This method should accelerate the development of complex systems-in-package and make the process more reliable.

 

Verdi

With today's design methods, the analog-digital barriers represent a major hurdle for evaluating the function of the entire system. VERDI developed a forward-looking design process that solves this problem.

e-BRAINS

E-BRAINS pursued the goal of developing innovative applications for all aspects of life based on nanoscale sensor systems.

V3DIM

The project partners layed the foundation for the design of innovative, highly integrated 3D system-in-package (SiP) solutions.