Adaptivity is an essential property for the connected world of tomorrow. Intelligent components can independently recognize changes in their environment or within themselves, assess them and take appropriate action. As business partner, Fraunhofer IIS/EAS develops key technologies for such adaptive systems and offers innovative as well as robust solutions.



Artificial Intelligence in Saxony

A recent free of charge study by Fraunhofer IIS/EAS analyzes the status quo of and prospects for artificial intelligence (AI) as a research topic and technology for industry solutions in Saxony.


Comprehensive AI Service for German Companies

Fraunhofer IIS/EAS joins forces with appliedAI from Garching near Munich, AI.HAMBURG and Artificial Intelligence Center Hamburg, Smart Systems Hub in Dresden and KI.NRW/Fraunhofer IAIS in Sankt Augustin near Bonn as part of the AI4Germany initiative. Together they want to actively support local companies in all regions of Germany in the application of AI.


Upcoming Event

IWLPC from October 13 to 15, 2020

At the International Wafer-Level Packaging Conference (IWLPC) in San Jose, California, experts from the semiconductor industry will discuss a variety of different aspects about the following topics: wafer level, 3D, TSV and MEMS component packaging and its manufacturing.


Upcoming Event

automatica from December 8 to 11, 2020

Apart from production-optimizing solutions and products, the world’s leading trade fair for smart automation and robotics also showcases all visionary key technologies in a single location.

Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems EAS

Zeunerstrasse 38
01069 Dresden
Phone +49 351 4640-701

From our work

System Packaging

With the increasing scope of functionality of electronic systems and advances in miniaturization, traditional chip designs are coming ever closer to their technological and economic limits. That is why novel integration concepts are needed.



Among others, our offers will help you profit from:

  • Higher system performance combined with low energy consumption
  • Maximum miniaturization of complex systems
  • Cost savings compared with comparable ASIC implementation
  • Reduced risk in the introduction of new packaging solutions

Research Fab Microelectronics

Fraunhofer IIS/EAS is participant of the Research Fab Microelectronics Germany.


Logo Research Fab Microelectronics