Adaptivity is an essential property for the connected world of tomorrow. Intelligent components can independently recognize changes in their environment or within themselves, assess them and take appropriate action. As business partner, Fraunhofer IIS/EAS develops key technologies for such adaptive systems and offers innovative as well as robust solutions.

News

 

The new EAS newsletter

Research on adaptive electronic systems is diverse and exciting. In the middle of June, numerous visitors were also convinced of this during the Dresden Long Night of Science. They looked behind our laboratory doors and found out more about our work on innovative system packages, self-optimizing controllers or methods for data analysis using AI.


Find out more about our work by reading our current newsletter

 

Globalfoundries, Fraunhofer and Next Big Thing found start-up

Sensry enables small and medium-sized businesses to gain access to innovative semiconductor technologies based on GLOBALFOUNDRIES 22FDX technology. Thus it enables the problem-free use of trend-setting system architectures and manufacturing methods also for prototypes and small series in connection with most modern assembly and packaging technologies.

 

Upcoming Event

IWLPC from October 22-24, 2019, in San Jose

At the IWLPC conference in San Jose, California, experts from the semiconductor industry will discuss a variety of different aspects about the following topics: wafer level, 3D, TSV and MEMS component packaging and its manufacturing.

 

Upcoming Event

DVCon Europe from October 29-31, 2019

The DVCon Europe held in Munich is the conference for design and verification in Europe and it features an accompanying exhibition. Technical experts from around the world come together at this event to exchange information on the latest developments on the use of EDA languages, methods and tools, which are being used for the development and verification of electronic systems and ICs.

Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems EAS

Zeunerstrasse 38
01069 Dresden
Phone +49 351 4640-701
Contact

From our work

System Packaging

With the increasing scope of functionality of electronic systems and advances in miniaturization, traditional chip designs are coming ever closer to their technological and economic limits. That is why novel integration concepts are needed.

 

 

Among others, our offers will help you profit from:

  • Higher system performance combined with low energy consumption
  • Maximum miniaturization of complex systems
  • Cost savings compared with comparable ASIC implementation
  • Reduced risk in the introduction of new packaging solutions

Research Fab Microelectronics

Fraunhofer IIS/EAS is participant of the Research Fab Microelectronics Germany.

 

Logo Research Fab Microelectronics