Press Release / 18.8.2022

Silicon Measurements for International Collaboration Project

Fraunhofer IIS/EAS performed silicon measurements and lab testing for a design that Cadence Design Systems, Inc. and GlobalFoundries collaborated on to accelerate 5G and mobile design innovation. As a proof point, the Cadence full-flow RF solution was used to design and tape out a 28GHz 5G mmWave IC as a complete system-in-package (SiP) solution.


A new building for applied microelectronics research

Almost exactly four years after ground was broken, Fraunhofer IIS/EAS officially opened its new institute building on June 30, 2022. Saxony’s Minister President Michael Kretschmer, Saxony’s State Minister of Science, Culture and Tourism Sebastian Gemkow and the President of the Fraunhofer-Gesellschaft, Professor Reimund Neugebauer, inaugurated the new building.


Join the fourth AI consortium project

The third consortium project, in which the INC Invention Center and Fraunhofer IIS/EAS help companies get ready to use artificial intelligence, is still ongoing, but preparations for the next project in this successful series are already underway. In the “AI: Understand – Apply – Benefit” consortium project, participants from a wide range of industries learn how to harness the potential of AI to their advantage.


A virtual world of innovation in micro- and nanoelectronics

Starting now, an interactive world invites anyone interested in the technologies that we and our research partners focus on at the High-Performance Center Mikronano to take a virtual tour of some of our work and developments.

Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems EAS

Muenchner Strasse 16
01187 Dresden, Germany
Phone +49 351 45691-0


From our work

System Packaging

With the increasing scope of functionality of electronic systems and advances in miniaturization, traditional chip designs are coming ever closer to their technological and economic limits. That is why novel integration concepts are needed.



Among others, our offers will help you profit from:

  • Higher system performance combined with low energy consumption
  • Maximum miniaturization of complex systems
  • Cost savings compared with comparable ASIC implementation
  • Reduced risk in the introduction of new packaging solutions

Research Fab Microelectronics

Fraunhofer IIS/EAS is participant of the Research Fab Microelectronics Germany.


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