Adaptivity is an essential property for the connected world of tomorrow. Intelligent components can independently recognize changes in their environment or within themselves, assess them and take appropriate action. As business partner, Fraunhofer IIS/EAS develops key technologies for such adaptive systems and offers innovative as well as robust solutions.

News

 

Globalfoundries, Fraunhofer and Next Big Thing found start-up

Sensry enables small and medium-sized businesses to gain access to innovative semiconductor technologies based on GLOBALFOUNDRIES 22FDX technology. Thus it enables the problem-free use of trend-setting system architectures and manufacturing methods also for prototypes and small series in connection with most modern assembly and packaging technologies.

 

EAS participates in new AI research center

Fraunhofer IIS/EAS is part of the "Center for Explainable and Efficient AI Technologies" (CEE AI), which was founded by Technische Universität Dresden and Fraunhofer-Gesellschaft on February 11, 2019. CEE AI supports excellent scientific research spanning the whole spectrum from hardware support, device communication, AI approaches and transfer into practice. A particular focus will be on efficient and explainable AI.

 

Upcoming Event

CDNLive from May 6 to 8, 2019 in Munich

At CDNLive, users of Cadence technologies will come together with developers and experts from industry to network and discuss their experience with design and verification issues.

 

Upcoming Event

Control from May 7 to 10, 2019 in Nuremberg

embedded world iis the world’s leading trade fair for embedded systems.  Here, Fraunhofer IIS/EAS will be presenting its products and services for everything related to system packaging and automated analogue design.

Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems EAS

Zeunerstrasse 38
01069 Dresden
Phone +49 351 4640-701
Contact

From our work

System Packaging

With the increasing scope of functionality of electronic systems and advances in miniaturization, traditional chip designs are coming ever closer to their technological and economic limits. That is why novel integration concepts are needed.

 

 

Among others, our offers will help you profit from:

  • Higher system performance combined with low energy consumption
  • Maximum miniaturization of complex systems
  • Cost savings compared with comparable ASIC implementation
  • Reduced risk in the introduction of new packaging solutions

Research Fab Microelectronics

Fraunhofer IIS/EAS is participant of the Research Fab Microelectronics Germany.

 

Logo Research Fab Microelectronics