Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS

Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS

Fraunhofer EAS Adaptive Systems

Adaptivity is an essential property for the connected world of tomorrow. Intelligent components can independently recognize changes in their environment or within themselves, assess them and take appropriate action. As business partner, Fraunhofer IIS/EAS develops key technologies for such adaptive systems and offers innovative as well as robust solutions.

Research Areas

Reliability of ICs
Functional Safety
Mixed-signal IC Design
System Packaging
Industrial Data Analysis
Wireless-networked Automation
Energy Management

News

 

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News from Fraunhofer IIS/EAS

Stay in touch and learn more about new developments, research projects or events of Fraunhofer IIS/EAS.

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Application Center Quantum Communication with new services

In addition to experimental environments and design services for the development of microelectronic components, the center offers companies and researchers a "test track" for quantum communication. The focus here is on modular microelectronic circuits for tap-proof data transmission.

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Chiplet Cooperation of Fraunhofer IIS/EAS and Achronix

Fraunhofer IIS/EAS uses Achronix Embedded FPGAs (eFPGAs) to build a heterogeneous chiplet demonstrator, which aimes at validating next-generation chip-to-chip interconnect technology.

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Webinar: Monitoring on industrial wireless communication – on September 6, 2023

In this webinar, we will present a spectral sensing system suitable for seamless 24/7 monitoring of radio channels used for wireless connectivity in the shop floor. 

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Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems EAS

Muenchner Strasse 16
01187 Dresden, Germany
Phone +49 351 45691-0
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From our work

System Packaging

With the increasing scope of functionality of electronic systems and advances in miniaturization, traditional chip designs are coming ever closer to their technological and economic limits. That is why novel integration concepts are needed.

 

 

Among others, our offers will help you profit from:

  • Higher system performance combined with low energy consumption
  • Maximum miniaturization of complex systems
  • Cost savings compared with comparable ASIC implementation
  • Reduced risk in the introduction of new packaging solutions

Research Fab Microelectronics

Fraunhofer IIS/EAS is participant of the Research Fab Microelectronics Germany.

 

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