Adaptivity is an essential property for the connected world of tomorrow. Intelligent components can independently recognize changes in their environment or within themselves, assess them and take appropriate action. As business partner, Fraunhofer IIS/EAS develops key technologies for such adaptive systems and offers innovative as well as robust solutions.

News

 

Artificial Intelligence in Saxony

A recent free of charge study by Fraunhofer IIS/EAS analyzes the status quo of and prospects for artificial intelligence (AI) as a research topic and technology for industry solutions in Saxony.

 

Comprehensive AI Service for German Companies

Fraunhofer IIS/EAS joins forces with appliedAI from Garching near Munich, AI.HAMBURG and Artificial Intelligence Center Hamburg, Smart Systems Hub in Dresden and KI.NRW/Fraunhofer IAIS in Sankt Augustin near Bonn as part of the AI4Germany initiative. Together they want to actively support local companies in all regions of Germany in the application of AI.

 

Upcoming Event

IWLPC from October 13 to 15, 2020

At the International Wafer-Level Packaging Conference (IWLPC) in San Jose, California, experts from the semiconductor industry will discuss a variety of different aspects about the following topics: wafer level, 3D, TSV and MEMS component packaging and its manufacturing.

 

Upcoming Event

automatica from December 8 to 11, 2020

Apart from production-optimizing solutions and products, the world’s leading trade fair for smart automation and robotics also showcases all visionary key technologies in a single location.

Coronavirus: measures taken by Fraunhofer IIS/EAS

The corona virus pandemic affects us all in one way or another. The Fraunhofer-Gesellschaft as well as Fraunhofer IIS/EAS are no exceptions.

Of course, even in these times we always want to achieve the best possible work results for our project partners and customers and continue to be a reliable contact for you. However, since the protection of employees and business partners is our highest priority, our colleagues are currently in their home offices, too. Meetings only take place virtually and planned events are cancelled.

Although you will not find us in the usual place at the moment, we are still available for you by e-mail and telephone. In individual cases, however, there may be restrictions in availability or delays in projects. We hope for your understanding in view of this exceptional situation.

 

Please, stay healthy!

Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems EAS

Zeunerstrasse 38
01069 Dresden
Phone +49 351 4640-701
Contact

From our work

System Packaging

With the increasing scope of functionality of electronic systems and advances in miniaturization, traditional chip designs are coming ever closer to their technological and economic limits. That is why novel integration concepts are needed.

 

 

Among others, our offers will help you profit from:

  • Higher system performance combined with low energy consumption
  • Maximum miniaturization of complex systems
  • Cost savings compared with comparable ASIC implementation
  • Reduced risk in the introduction of new packaging solutions

Research Fab Microelectronics

Fraunhofer IIS/EAS is participant of the Research Fab Microelectronics Germany.

 

Logo Research Fab Microelectronics