News

 

7th Chiplet Center of Excellence (CCoE) Industry Workshop

At the 7th Industry Workshop of the Chiplet Center of Excellence (CCoE) in Dresden, industry partners exchanged insights on the latest advancements and emerging applications of chiplet technologies. The focus was on the collaborative development of modular, scalable systems, with the clear goal of accelerating the transfer of innovative approaches into industrial practice.

 

APECS pilot line – Focus on the European chip initiative

In early March at the Dresden site, we offered insights into our work within the APECS pilot line – a European platform intended to accelerate the transfer of innovations from the world of research into industrial applications. A visit by high-ranking European representatives highlighted the importance of collaboration, new approaches and practical developments for the future of microelectronics.

 

FIRST by FMD: Save the Date

With FIRST by FMD, Europe’s new leading conference for microelectronics and semiconductor technologies is coming to Berlin. The event brings together leading experts from industry, research, and politics to discuss technological trends, innovation, and the future of the European semiconductor industry.

 

CHASSIS – Joint initiative for automotive chiplet technology

The CHASSIS initiative is advancing the development of chiplet technologies for the next generation of software-defined vehicles. Its goal is to create powerful and flexible semiconductor architectures that make future automotive electronics more efficient and scalable.

Innovation topics

 

Artificial intelligence

We help our customers and partners master their challenges in a practical, customized fashion using various AI approaches. Our solutions are tailored particularly to use cases in which permanent data sovereignty, data protection and high processing speed are vitally important, as well as the traceability of the processes by which the AI systems arrive at their results.

 

Intelligent multi-sensor systems – universal sensor platform

So that smaller systems providers can shoulder the growing development and manufacturing costs for next-generation electronics, a Fraunhofer consortium from Saxony has teamed up with GlobalFoundries to develop a "universal sensor platform" (USeP).

 

Quantum communication

Many of the asymmetric and symmetric encryption methods currently used for the secure transmission of data and information are, in principle, vulnerable to attackers. Systems for the exchange of quantum keys allow a key of any length to be exchanged securely. In our work, we focus on furthering the development of the necessary nanoelectronic components.

 

Trusted Electronics

Given that electronics are used in many safety-critical areas, such as autonomous driving or medicine, it is vital that users are able to trust them. Trusted electronics are electronics whose mode of operation is precisely understood – regardless of whether they were designed and manufactured in Germany or elsewhere.

Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems

Muenchner Strasse 16
01187 Dresden, Germany
Phone +49 351 45691-0
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From our work

Getting started with artificial intelligence for SMEs

In business practice, AI is particularly valuable where traditional solutions are not efficient enough or have reached their limits. However, SMEs in particular often face major challenges when using AI.  

This is where the Application and Test Center AI (ATKI), which is currently being established at Fraunhofer IIS/EAS in Dresden, comes in. Its services are designed to help companies use AI profitably and thus secure competitive advantages. The center aims to lower barriers to entry and support the rapid implementation of solutions in practice.

Research Fab Microelectronics

Fraunhofer IIS/EAS is participant of the Research Fab Microelectronics Germany.

 

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