Adaptivity is an essential property for the connected world of tomorrow. Intelligent components can independently recognize changes in their environment or within themselves, assess them and take appropriate action. As business partner, Fraunhofer IIS/EAS develops key technologies for such adaptive systems and offers innovative as well as robust solutions.

News

 

Comprehensive AI Service for German Companies

Fraunhofer IIS/EAS joins forces with appliedAI from Garching near Munich, AI.HAMBURG and Artificial Intelligence Center Hamburg, Smart Systems Hub in Dresden and KI.NRW/Fraunhofer IAIS in Sankt Augustin near Bonn as part of the AI4Germany initiative. Together they want to actively support local companies in all regions of Germany in the application of AI.

 

The new EAS newsletter

Did you know that forecasts assume that semiconductor revenue from systems using chiplets will grow worldwide from $500 million in 2018 to more than $45 billion in 2023.


Find out about chiplets and more from our work by reading our current newsletter

 

Upcoming Event

Embedded World February 25 to 27, 2020 in Nuremberg

embedded world is the world’s leading trade fair for embedded systems – be it security for electronic systems, distributed intelligence, the Internet of Things or e-mobility and energy efficiency. We are pleased to present our solutions on automated analog chip design and advanced packaging. Visit us at our booth (hall 4, 460/470) or meet our experts during program session 10.2 SoC II (02/25/20, 9:30 and 12:00)

Upcoming Event

CDNLive from May 13 to 14, 2020

At CDNLive in Munich, users of Cadence technologies will come together with developers and experts from industry to network and discuss their experience with design and verification issues.

Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems EAS

Zeunerstrasse 38
01069 Dresden
Phone +49 351 4640-701
Contact

From our work

System Packaging

With the increasing scope of functionality of electronic systems and advances in miniaturization, traditional chip designs are coming ever closer to their technological and economic limits. That is why novel integration concepts are needed.

 

 

Among others, our offers will help you profit from:

  • Higher system performance combined with low energy consumption
  • Maximum miniaturization of complex systems
  • Cost savings compared with comparable ASIC implementation
  • Reduced risk in the introduction of new packaging solutions

Research Fab Microelectronics

Fraunhofer IIS/EAS is participant of the Research Fab Microelectronics Germany.

 

Logo Research Fab Microelectronics