Adaptivity is an essential property for the connected world of tomorrow. Intelligent components can independently recognize changes in their environment or within themselves, assess them and take appropriate action. As business partner, Fraunhofer IIS/EAS develops key technologies for such adaptive systems and offers innovative as well as robust solutions.

News

 

The new EAS newsletter

Artificial intelligence (AI) is currently one of the most exciting topics in industry. Find out more about some of our current projects and activities in this field and about how we can assist companies in making AI profitable

 

Globalfoundries, Fraunhofer and Next Big Thing found start-up

Sensry enables small and medium-sized businesses to gain access to innovative semiconductor technologies based on GLOBALFOUNDRIES 22FDX technology. Thus it enables the problem-free use of trend-setting system architectures and manufacturing methods also for prototypes and small series in connection with most modern assembly and packaging technologies.

 

Upcoming Event

Dresden Science Night on June 14, 2019

Rise and shine, show a leg! Get out of your bed - stop pillow fights and do science instead! On June 14th the Dresden Science Night will take place for the 17th time. Between 6pm and 11.30 pm we together with lots of researching institutes and universities open the doors for curious science enthusiasts. 

 

Upcoming Event

IWLPC from October 22-24, 2019, in San Jose

At the IWLPC conference in San Jose, California, experts from the semiconductor industry will discuss a variety of different aspects about the following topics: wafer level, 3D, TSV and MEMS component packaging and its manufacturing.

Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems EAS

Zeunerstrasse 38
01069 Dresden
Phone +49 351 4640-701
Contact

From our work

System Packaging

With the increasing scope of functionality of electronic systems and advances in miniaturization, traditional chip designs are coming ever closer to their technological and economic limits. That is why novel integration concepts are needed.

 

 

Among others, our offers will help you profit from:

  • Higher system performance combined with low energy consumption
  • Maximum miniaturization of complex systems
  • Cost savings compared with comparable ASIC implementation
  • Reduced risk in the introduction of new packaging solutions

Research Fab Microelectronics

Fraunhofer IIS/EAS is participant of the Research Fab Microelectronics Germany.

 

Logo Research Fab Microelectronics