Adaptivity is an essential property for the connected world of tomorrow. Intelligent components can independently recognize changes in their environment or in their system, assess these changes and adapt to them automatically. As business partner, Fraunhofer IIS/EAS develops key technologies for these adaptive systems and offers innovative as well as robust systems solutions.



Our new newsletter

The current issue gives you insight into our research work again. Among others, we are part in a project with the goal of a pilot line for "More-than-Moore technologies" in Dresden. Another project is researching the optimization of latency for real-time communication in distributed sensor actuator systems.


Spin-off from Fraunhofer IIS/EAS offers software for the development of ultra-modern electronics

COSEDA Technologies GmbH in Dresden began its business activities in July 2015. The team consisting of former employees of the Fraunhofer research institute IIS/EAS now offers software that companies around the world can use to develop particularly complex electronic products more reliably, more quickly and more cost-effectively. The company can rely on the know-how accumulated during more than 15 years of cooperation by Fraunhofer IIS/EAS with the semiconductor industry.


Advanced EDA Tools and Services Now Available in North America

The Division “Engineering of Adaptive Systems” of the German Fraunhofer IIS/EAS is now offering its Electronic Design Automation products and design expertise in North America for the first time.


Current Events

SPS IPC Drives from November 22 to 24, 2016

At the SPS IPC Drives in Nuremberg, Fraunhofer IIS/EAS introduces a new approach of dual radio analysis in industrial automation.

Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems EAS

Zeunerstrasse 38
01069 Dresden
Phone +49 351 4640-701


COSIDE by Fraunhofer IIS/EAS is the tool to develop innovative electronic or heterogeneous. This software tool is the first SystemC/SystemC AMS based commercial design environment to model and simulate higly complex heteroneous systems.

System Integration

With the increasing functionality of electronic systems and the need for increasing miniaturization, the traditional integration of all functions on a single chip (SoC) encounters technological and commercial limitations. One solution is the integration of multiple chips in a single housing from SIP to 3D.

Always up-to-date

Follow us on