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The Electronic Components and Technology Conference (ECTC) in Las Vegas, USA is the leading international event for researchers and developers to share ideas on topics such as packaging, components and microelectronic systems.
At the IWLPC conference in San Jose, California, experts from the semiconductor industry will discuss a variety of different aspects about the following topics: wafer level, 3D, TSV and MEMS component packaging and its manufacturing.
The DVCon Europe held in Munich is the conference for design and verification in Europe and it features an accompanying exhibition. Technical experts from around the world come together at this event to exchange information on the latest developments on the use of EDA languages, methods and tools, which are being used for the development and verification of electronic systems and ICs.
The SPS – Smart Production Solutions – in Nuremberg is considered Europe's leading trade fair for the electronic automation industry.
The IEDM in San Francisco, USA is the flagship conference for technologies, such as nanometer CMOS transistors, memories, displays, sensors MEMS components or components for energy.