Visit us at Chiplet Summit 2026 – the international meeting point for innovations in chip design, advanced packaging, and AI acceleration! The Fraunhofer Institute for Integrated Circuits IIS is a world leader in research on microelectronic and IT system solutions and services. Chiplet integration is revolutionizing the development of electronic systems, and we are at the forefront of this exciting trend. Our expertise spans system, component, and transistor levels, ensuring a comprehensive approach to your project. At the system level, we focus on innovative architectures that push boundaries. Meanwhile, we pay special attention to the critical interfaces between chiplets and power supplies at the component level, ensuring seamless performance and reliability.
Join us and our partners at a shared booth at maintenance Dortmund 2026 – Germany’s premier trade fair for industrial maintenance! Come see us, connect, and explore new ideas together. We can’t wait to meet you!
Chiplet integration is revolutionizing electronic systems — with our help, take advantage of the potential offered by this new technology! Our expertise spans the system, component, and transistor levels, ensuring a comprehensive approach to your project. We see chiplets as next step of your ASICs. Using our efficient design methods, we create innovative architectures and always focus on the chiplet interfaces to ensure seamless performance and reliability.
Rising complexity and cost pressure in semiconductor design demand new approaches. This webinar explores how chiplet architectures and heterogeneous integration enable high-performance, cost-efficient systems. Learn how advanced design methodologies combine multiple technology domains, account for all critical effects, and meet performance and cost targets with confidence.
Active Learning is a powerful machine learning approach that reduces training data requirements while improving model performance. This webinar introduces core Active Learning principles and state-of-the-art strategies for image and time-series data. Through real-world use cases such as wood defect detection and tool wear monitoring, learn how targeted data labeling cuts annotation effort, lowers costs, and accelerates model development.
This year's SMACD conference will take place in Dresden from June 29 to July 2, 2026. It brings together international experts from circuit synthesis, modeling, simulation, EDA, and integrated circuits. Present your research, network with professionals, and learn about the latest trends in analog & mixed-signal design, RF systems, and simulation technologies.