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Upcoming Events

European 3D Summit from 22 to 24 January 2018

This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of state-of-the-art 3D topics. Fraunhofer IIS/AS will presents its solutions for Assembly Design Kits (ADK) and Interposer design.

Hannover Messe from 23 to 27 April 2018

Every spring, the full range of the industrial value chain from around the world can be seen on the fair grounds in Hanover. At the joint stand “SmartConnected” in hall 8, we will be presenting our Wireless Network Analyzer for industrial wireless networks.

DAC 2018 from 24 to 28 June 2018

The Design Automation Conference (DAC) in San Francisco is considered the world’s most important conference and trade fair for the automated development of electronic systems.

VISION from 6 to 8 November 2018

VISION in Stuttgart is the world's leading trade fair for image processing and a marketplace for component manufacturers as well as a platform for system providers and integrators. In this context, Fraunhofer IIS/EAS will present its vision-system-on-chip as well as the corresponding application possibilities.

electronica from 13 to 16 November 2018

electronica in Munich is the international trade fair for electronic components, systems and applications. Fraunhofer IIS/EAS will be sharing information on topics of IC design as well as reliability and lifespan forecasting.

SPS IPC Drives from 27 to 29 November 2018

SPS IPC Drives in Nuremberg is Europe's leading trade fair of the electric automation industry. With its Wireless Network Analyzer, Fraunhofer IIS/EAS will be presenting its solution for fast and convenient inspection of industrial wireless networks.