Events

Trainings

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Review

Get to know more about past events of Fraunhofer IIS/EAS.

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Upcoming Events

Chiplet Summit 2026

February 17-19, 2026

Visit us at Chiplet Summit 2026 – the international meeting point for innovations in chip design, advanced packaging, and AI acceleration! We look forward to connecting with you!

Chiplet Summit 2026
© 2025 Chiplet Summit

maintenance Dortmund

February 25-26, 2026

Join us and our partners at a shared booth at maintenance Dortmund 2026 – Germany’s premier trade fair for industrial maintenance! Come see us, connect, and explore new ideas together. We can’t wait to meet you!

maintenance 2026 logo
© maintenance 2026

Fraunhofer goes embedded world

March 10-12, 2026

Chiplet integration is revolutionizing electronic systems — with our help, take advantage of the potential offered by this new technology! Our expertise spans the system, component, and transistor levels, ensuring a comprehensive approach to your project. We see chiplets as next step of your ASICs. Using our efficient design methods, we create innovative architectures and always focus on the chiplet interfaces to ensure seamless performance and reliability.

© embedded world