Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EASTrainings
We support you in the qualification of your staff by offering trainings on different modeling languages.
Events
International Wafer-Level Packaging Conference October 13 to 15, 2020
At the IWLPC conference in San Jose, California, experts from the semiconductor industry will discuss a variety of different aspects about the following topics: wafer level, 3D, TSV and MEMS component packaging and its manufacturing.
automatica December 8 to 11, 2020
Apart from production-optimizing solutions and products, the world’s leading trade fair for smart automation and robotics also showcases all visionary key technologies in a single location.
VISION November 10 to 12, 2020
VISION is the world’s leading trade fair for machine vision. The who’s who in the machine vision industry meets in Stuttgart and presents an incomparable range of products and services: from sensors to processors, from cables to cameras, from software to illumination systems.
