Event Review

Past Events with Contribution of the Division EAS

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  • Dresden / 01/22/2018 - 01/24/2018

    European 3D Summit

    Logo SEMI European 3D Summit 2018

    This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of state-of-the-art 3D topics. Fraunhofer IIS/AS will presents its solutions for Assembly Design Kits (ADK) and Interposer design.

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  • San Francisco, Californien / 06/24/2018 - 06/28/2018

    DAC 2018

    Teaser DAC 2018

    The Design Automation Conference (DAC) in San Francisco is considered the world’s most important conference and trade fair for the automated development of electronic systems.

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  • Stuttgart / 11/06/2018 - 11/08/2018

    VISION

    Fair Vision 2018

    VISION in Stuttgart is the world's leading trade fair for image processing and a marketplace for component manufacturers as well as a platform for system providers and integrators. Come and visit us in hall 1 at booth No. G42 and learn more about our vision-system-on-chip and its corresponding application possibilities.

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  • Munich / 11/13/2018 - 11/16/2018

    electronica

    Teaser electronica 2018

    electronica in Munich is the international trade fair for electronic components, systems and applications. Fraunhofer IIS/EAS will be sharing information on topics of IC design as well as reliability and lifespan forecasting.

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  • Nuremberg / 11/27/2018 - 11/29/2018

    SPS IPC Drives

    Teaser SPS IPC Drives 2017

    SPS IPC Drives in Nuremberg is Europe's leading trade fair of the electric automation industry. Come and visit as in hall 5 at booth No. 230 Q and learn more about our Wireless Network Analyzer, the Fraunhofer IIS/EAS solution for fast and convenient inspection of industrial wireless networks.

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  • Nuremburg / 02/26/2019 - 02/28/2019

    Embedded World

    Teaser embedded world

    embedded world in Nurnberg is the world’s leading trade fair for embedded systems. Here, Fraunhofer IIS/EAS will be presenting its products and services for everything related to system packaging and automated analogue design.

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