Event Review

Past Events with Contribution of the Division EAS

  • Dresden /  January 22, 2018 - January 24, 2018

    European 3D Summit

    Logo SEMI European 3D Summit 2018

    This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of state-of-the-art 3D topics. Fraunhofer IIS/AS will presents its solutions for Assembly Design Kits (ADK) and Interposer design.

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  • San Francisco, Californien /  June 24, 2018 - June 28, 2018

    DAC 2018

    Teaser DAC 2018

    The Design Automation Conference (DAC) in San Francisco is considered the world’s most important conference and trade fair for the automated development of electronic systems.

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  • Stuttgart /  November 06, 2018 - November 08, 2018


    Fair Vision 2018

    VISION in Stuttgart is the world's leading trade fair for image processing and a marketplace for component manufacturers as well as a platform for system providers and integrators. Come and visit us in hall 1 at booth No. G42 and learn more about our vision-system-on-chip and its corresponding application possibilities.

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  • Munich /  November 13, 2018 - November 16, 2018


    Teaser electronica 2018

    electronica in Munich is the international trade fair for electronic components, systems and applications. Fraunhofer IIS/EAS will be sharing information on topics of IC design as well as reliability and lifespan forecasting.

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  • Nuremberg /  November 27, 2018 - November 29, 2018

    SPS IPC Drives

    Teaser SPS IPC Drives 2017

    SPS IPC Drives in Nuremberg is Europe's leading trade fair of the electric automation industry. Come and visit as in hall 5 at booth No. 230 Q and learn more about our Wireless Network Analyzer, the Fraunhofer IIS/EAS solution for fast and convenient inspection of industrial wireless networks.

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  • Nuremburg /  February 26, 2019 - February 28, 2019

    Embedded World

    Teaser embedded world

    embedded world in Nurnberg is the world’s leading trade fair for embedded systems. Here, Fraunhofer IIS/EAS will be presenting its products and services for everything related to system packaging and automated analogue design.

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  • Munich /  May 06, 2019


    Teaser CDNLive 2017

    At CDNLive in Munich, users of Cadence technologies will come together with developers and experts from industry to network and discuss their experience with design and verification issues.

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  • Stuttgart /  May 07, 2019 - May 10, 2019


    Teaser Control

    As an international trade fair for quality assurance, “Control” in Stuttgart will highlight all aspects of the theory and present the usable technologies, methods, products and system solutions for industrial quality assurance that are currently available on the global market.

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  • Las Vegas, USA /  May 28, 2019 - May 31, 2019

    Electronic Components and Technology Conference (ECTC)

    Teaser ECTC

    The Electronic Components and Technology Conference (ECTC) in Las Vegas, USA is the leading international event for researchers and developers to share ideas on topics such as packaging, components and microelectronic systems.

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  • Munich /  October 11, 2019

    GLOBALFOUNDRIES Technology Conference

    Logo GTC 2019

    At the foundry's Technology Conference in Munich experts discuss about solutions for markets including Mobile & Wireless Infrastructure, Computing & Wired Infrastructure or Automotive, Industrial & Multi-Market.

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