Past Events with Contribution of the Division EAS

  • Nuremberg / February 25, 2020 - February 27, 2020

    Embedded World

    Teaser embedded world

    embedded world in Nuremburg is the world’s leading trade fair for embedded systems. Be it security for electronic systems, distributed intelligence, the Internet of Things or e-mobility and energy efficiency – the trade fair enables you to experience the whole world of embedded systems.

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  • Munich / May 13, 2020 - May 14, 2020


    Teaser CDNLive 2017

    At CDNLive in Munich, users of Cadence technologies will come together with developers and experts from industry to network and discuss their experience with design and verification issues.

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  • Dresden / Online / September 16, 2020 - September 17, 2020

    AI Innovation Days

    AI Innovation Days

    The AI Innovation Days on September 16 and 17, 2020 are being staged as a combination of live event and virtual event, offering companies comprehensive insights into numerous facets of AI in Saxon applications. More than 20 experienced actors and experts from business, research and politics will be discussing current, sector driven AI topics. Thanks to live streaming, the audience will be able to follow the event and also actively interact with the speakers.

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  • San Jose, USA  / October 13, 2020 - October 15, 2020


    Teaser IWLPC

    At the IWLPC conference in San Jose, California, experts from the semiconductor industry will discuss a variety of different aspects about the following topics: wafer level, 3D, TSV and MEMS component packaging and its manufacturing.

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  • Online / October 16, 2020

    Globalfoundries Technologies Conference

    GTC 2020

    Auf der Technology Conference des Halbleiterherstellers diskutieren Fachleute virtuell aktuelle und zukünftige Herausforderungen und Innovationen in der Mikroelektronik-Industrie. Wir geben in der virtuellen Ausstellung Einblicke in die Themen System Packaging und Analog Design Automation.

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  • Online / April 12, 2021 - April 16, 2021


    At the digital HANNOVER MESSE, the focus will be on a comprehensive conference program, the digitization of product presentations and software-based business dating.

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  • Dresden / May 27, 2021

    Silicon Saxony Day

    Teaser Silicon Saxony e. V.

    Silicon Saxony Day has been the largest ICT conference in Saxony for over 15 years. It offers cross-sector insights into current and future technologies and solutions in the areas of hardware, software and connectivity. In addition to Saxony's largest high-tech network with its more than 350 members, start-ups, small, medium-sized and large companies, research institutions, business development agencies, authorities and institutions from Saxony, Germany, Europe and the world meet here every year. In addition to the transfer of knowledge and technology, the aim of the event is the open exchange between developers, producers and users of current or upcoming information and communication technologies.

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  • Online / June 01, 2021 - June 04, 2021

    Electronic Components and Technology Conference (ECTC)

    Teaser ECTC

    The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

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  • Aachen / virtual / June 23, 2021 - June 24, 2021

    Technology and Innovation Summit 2021

    »Technology Meets Innovation – Towards an Intelligent and Sustainable Future« lautet das Motto des diesjährigen INC Technology and Innovation Summit. Bei der Veranstaltung am 23. und 24. Juni werden sich Experten mit Entscheidern aus der Industrie zu aktuellen Fragestellungen der technologischen Transformation austauschen. Das Themenfeld KI-Innovationen wird durch das Fraunhofer IIS/EAS in Kooperation mit dem INC Invention Center bespielt.

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  • Online / September 15, 2021

    GF Technology Summit 2021 - North America

    GF Technology Summit 2021 - North America

    The Globalfoundries Technology Summit is an opportunity to discuss the challenges and opportunities in semiconductor design and manufacturing, learn about new technologies and solutions, and discover new ways to collaborate, partner and invest. The goal is to work together to offer more innovation, more possibilities, more intuitive interaction, more intelligence, and more feature-rich solutions. Fraunhofer IIS/EAS will present its latest developments in System Packaging and Analog Design Automation at the virtual event.

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