Business Area Efficient Electronics

The future of electronics is smart. It will support users in even more areas of their life, while working in a highly sustainable and efficient manner in many respects. However, increasing miniaturization, (data) security requirements, new manufacturing technologies and ever more functions in the tightest of spaces present particular challenges as regards performance capability and the design process.

This is why a large part of our work involves coming up with new design concepts to meet the challenge of the constant miniaturization of semiconductor components and the growing complexity of integrated circuits. Our goal is to ensure the swift, resource-efficient, error-free, safe and secure development of electronic systems. Another focus of our work is on new “More than Moore” technologies, which make it possible to combine a wide variety of assemblies in a single component. One advantage of this is to facilitate higher performance coupled with more efficient use of energy. With our design know-how, we at Fraunhofer IIS/EAS also develop high-performance technical systems that master particularly complex tasks using innovative approaches.



System Packaging

With the increasing functionality of electronic systems and the need for increasing miniaturization, the traditional integration of all functions on a single chip (SoC) encounters technological and commercial limitations. One solution is the integration of multiple chips in a single housing from SIP to 3D.


Analog Design Automation

The efficient design of integrated circuits and systems is practically only possible with the use of software solutions. While the design of digital circuits is largely automated, analog components are for the most part still designed manually. With increasing miniaturization, however, this task is becoming increasingly complex and it is, thus, highly prone to errors. The result is long development cycles and high costs.


Mixed-signal IC Design

Powerful and energy-efficient sensor systems are the key to many technical innovations of the future, whether in the field of automotive design, industrial automation or medical technology. Mixed-signal ICs with digital and analog components form the basis for this innovation. We are able to significantly improve the efficiency of your design through the use of new methods. For ASIC developments, we offer the complete value creation chain, including series production for small and medium volumes.

Project Examples and References


ASIC development is associated with significant economic risk for small and medium-sized companies due to the high investment costs for mostly smaller batch sizes. AnastASICA aims to make it possible for them to produce new ASICs much more economically than before.


The aim of the project is to develop manufacturing technologies for the next generation of highly integrated microelectronics. In the course of these efforts, the project members will develop procedures and have them interact to produce ICs with channel lengths of just three nanometers.


Future technical solutions in the Internet of Things are subject to especially high requirements for energy-efficient, small and inexpensive components. The "PRIME" project is establishing the prerequisites for the required manufacturing technologies in Germany and Europe.

Industrial Reference

Dream Chip
Technologies GmbH

Fine-pitch package substrate for a multifunctional system-on-chip


With the development of a highly energy-efficient modular hardware solution, a Fraunhofer lighthouse project is laying the foundation for a ubiquitous Internet of Things.


Productive 4.0

In the European research initiative “Productive 4.0”, more than 100 partners from business and industry have come together to advance the field of industrial digitalization and networking.