Munich  /  January 24, 2023  -  January 26, 2023

Chiplet Summit Conference & Exhibition

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The first annual Chiplet Summit addresses chip designers and provides knowledge and exchange around the topics of scalability and performance with lower power consumption of chiplets. Chiplet expert at Fraunhofer IIS/EAS, Andy Heinig, shared the latest packaging updates in several sessions as well as presented the topic of chiplets for the development of advanced driver assistance systems.