| Jahr | Titel/Autor | Dokumentart |
| 2018 | Aging Models: The Basis for Predicting Circuit Reliability: Redaktionell betreuter Blog-Beitrag auf https://semiengineering.com, 12. April 2018
Lange, André | Elektronische Publikation
|
| 2018 | The Analog Design Gap: Blog-Beitrag auf https://semiengineering.com, 8. März 2018
Prautsch, Benjamin; Reich, Torsten | Elektronische Publikation
|
| 2018 | Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation
Clausner, André; Schlipf, Simon; Kurz, G.; Otto, M.; Paul, J.; Giering, Kay-Uwe; Warmuth, Jens; Lange, André; Jancke, Roland; Aal, A.; Rosenkranz, Rüdiger; Gall, Martin; Zschech, Ehrenfried | Konferenzbeitrag |
| 2018 | Digital control for off-line power supplies using digital platform DP2: Presentation held at International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy Management, 5 - 7 June 2018, Nuremberg, PCIM Europe 2018
Radecker, Matthias; Trentin, Vinicius; Le, Li | Vortrag
|
| 2018 | Dynamic fault injection for system level simulation of MEMS - a design method for functional safety
Blochmann, Tino; Schneider, Peter; Markwirth, Thomas; Gerth, Stephan; Jancke, Roland | Konferenzbeitrag
|
| 2018 | Electronic design for reliable autonomous driving: Redaktionell betreuter Blog-Beitrag auf https://semiengineering.com/, 11. Januar 2018
Jancke, Roland | Elektronische Publikation
|
| 2018 | Energy harvesting and conversion - applications of piezoelectric transformer and transducer MEMS: Presentation held at IFAAP 2018 - Session 31am-A05-Energy Harvesters, ISAF-FMA-AMF-AMEC-PFM (IFAAP) Joint Conference in Hiroshima, May 27th - June 1st, 2018
Radecker, Matthias; Kunzmann, Jan; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Yang, Yujia | Vortrag
|
| 2018 | Enhanced behavioral models of MEMS elements for system level verification
Blochmann, Tino; Gerth, Stephan; Schneider, Peter; Jancke, Roland | Konferenzbeitrag |
| 2018 | Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas | Konferenzbeitrag |
| 2018 | Funktional mock-up interface paving the way for digital twins: Presentation held at FDL 2018 - Panel on FMI, 11. September 2018; Forum on Specification & Design Languages, Munich, Germany, September 10 - 12, 2018
Schneider, Peter | Vortrag |
| 2018 | A high speed asynchronous multi input pipeline for compaction and transfer of parallel SIMD data
Hoppe, Christoph; Döge, Jens; Reichel, Peter; Russell, Patrick; Reichel, Andreas; Schneider, Peter | Konferenzbeitrag
|
| 2018 | Identification of dynamic models for the short-term temperature prediction in a single room
Paschke, Fabian; Zaiczek, Tobias | Zeitschriftenaufsatz |
| 2018 | IIP generators to ease analog IC design: Poster presented at Design, Automation & Test in Europe, DATE 2018, 19 - 23 March 2018, Dresden, Germany
Prautsch, Benjamin; Eichler, Uwe; Reich, Torsten | Poster
|
| 2018 | Lifetime verification by circuit level aging simulations: Presentation held at Cadence User Conference CDN-Live EMEA 2018, Munich, Germany, May 7-9
Jancke, Roland | Vortrag
|
| 2018 | Live demonstration: Hitting a table tennis ball with a programmable vision-system-on-chip
Döge, Jens; Hoppe, Christoph; Reichel, Andreas; Reichel, Peter; Peter, Nico; Priwitzer, Holger | Konferenzbeitrag
|
| 2018 | Low-latency image acquisition and processing with a programmable vision-system-on-chip
Döge, Jens; Hoppe, Christoph; Reichel, Andreas; Peter, Nico; Priwitzer, Holger | Konferenzbeitrag
|
| 2018 | Mission Profiles. The current state and future development of a key concept of reliability assessment: Redaktionell betreuter Blog-Beitrag auf https://semiengineering.com, 13. September 2018
Warmuth, Jens Michael | Elektronische Publikation
|
| 2018 | Multiphysics Challenges for EDA Tools: Redaktionell betreuter Blog-Beitrag auf https://semiengineering.com, 10.05.2018
Sohrmann, Christoph | Elektronische Publikation
|
| 2018 | Optimierungs- und Planungsplattform für die energieeffiziente Fertigung von Sicherheitsglas - Optplanenergie: Gemeinsamer Abschlussbericht. Sachbericht
Seidel, Stephan; Baumann, Frank; Wilson, Heike; Gromnitza, Ulrike | Bericht
|
| 2018 | Prediction of SRAM reliability under mechanical stress induced by harsh environments
Warmuth, Jens; Giering, Kay-Uwe; Lange, André; Clausner, André; Schlipf, Simon; Kurz, Gottfried; Otto, Michael; Paul, Jens; Jancke, Roland; Aal, Andreas; Gall, Martin; Zschech, Ehrenfried | Konferenzbeitrag
|
| 2018 | Predictive maintenance in tomorrow's industries: Redaktionell betreuter Blog-Beitrag auf https://semiengineering.com, 09.08.2018
Enge-Rosenblatt, Olaf; Brandt, Steven | Elektronische Publikation
|
| 2018 | Simulation, testing and implementation of temperature-reduction solutions on a high-power thermal demonstrator: Paper presented at ITherm 2018, 17th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 29 - June 1, 2018, San Diego, California
Heinig, Andy; Papaioannou, Dimitrios | Vortrag
|
| 2018 | Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, DTIP 2018: Roma, Italy, May 22nd - May 25th, 2018
Mailly, Frédérick; Marcelli, Romolo; Mita, Yoshio; Nouet, Pascal; Pressecq, Francis; Schneider, Peter; Smith, Steward ; Institute of Electrical and Electronics Engineers -IEEE- | Tagungsband |
| 2018 | System analysis of six-port-based RF-receivers
Mailand, M. | Zeitschriftenaufsatz |
| 2018 | Template-driven analog layout generators for improved technology independence
Prautsch, Benjamin; Hatnik, Uwe; Eichler, Uwe; Lienig, Jens | Konferenzbeitrag |
| 2018 | Ultra-low-power SAR ADC in 22 nm FD-SOI technology using body-biasing
Jotschke, Marcel; Rao, Sunil Satish; Prautsch, Benjamin; Reich, Torsten | Konferenzbeitrag |
| 2018 | Upcoming System Modeling Challenges: Redaktionell betreuter Blog-Beitrag auf https://semiengineering.com, 14.06.2018
Gerth, Stephan | Elektronische Publikation
|
| 2018 | Why use an assembly design kit and assembly design flow?: Blog-Beitrag auf https://semiengineering.com, 8. Februar 2018
Heinig, Andy | Elektronische Publikation
|
Fraunhofer-Institut für Integrierte Schaltungen IIS, Institutsteil Entwicklung Adaptiver Systeme EAS