The embedded world exhibition was held in Nuremberg from March 10 to 12, 2026. This is the principal platform for embedded systems, sensor technology, and intelligent edge solutions. At the joint booth, Fraunhofer IIS in Dresden presented its latest developments in the areas of embedded systems, edge AI, and chip design and gave expert visitors the chance to learn about practical solutions. One key highlight was the booth event entitled »Chiplet Development and Applications from a European Perspective,« at which experts from research and industry presented and discussed current challenges and solutions relating to chiplet technologies. We asked our booth team – Dr. Benjamin Prautsch, Group Manager Mixed-Signal Automation, and Andy Heinig, Head of the Chiplet Center of Excellence – for their individual impressions.

5 people stand next to an exhibit at a trade fair and look into the camera.
© Fraunhofer IIS
The booth team from Fraunhofer IIS in Dresden present the exhibits and research topics at embedded world 2026 in Nuremberg.
Lecture during the trade fair. A person stands next to a large screen and gives a lecture. You can see participants sitting at round tables and listening.
© Fraunhofer IIS
Event at the joint Fraunhofer booth during the embedded world 2026 exhibition in Nuremberg.
Employee of Fraunhofer IIS in Dresden present the exhibits to trade fair visitors during embedded world 2026 in Nuremberg.
© Fraunhofer IIS
The team from Fraunhofer IIS in Dresden present the exhibits to visitors during embedded world 2026 in Nuremberg.

What did you think of the exhibition?
Dr. Benjamin Prautsch, Group Manager Mixed-Signal Automation:
»The exhibition was a very lively event and provided an opportunity for lots of interesting conversations. On the one hand, visitors to our booth were keen to find out about our work in general. On the other hand, they wanted to know more about microelectronics topics in particular. At the booth event, we showed how complex chiplet systems can be developed effectively in the face of cost and performance requirements, presenting concepts including the STCO design methodology within the framework of the APECS pilot line. Our conversations at the booth highlighted the specific needs of industry – and that’s what makes an exhibition particularly valuable for me.«

What were the main topics?
 Andy Heinig, Head of the Chiplet Center of Excellence:
»Many visitors wanted to know more about modular solutions to their electronics problems and how they can be applied in industry and the automotive sector. These solutions can be implemented via flexible chip and packaging concepts. In this context, there was frequent mention of system technology co-optimization (STCO), which supports the efficient design of heterogeneous chiplet prototypes. Another key topic was APECS, our pilot line for the conception, design, production, and evaluation of heterogeneous systems. Many partners expressed an interest in how APECS enables new developments and can improve the cost effectiveness and reliability of systems.«


How did the booth event go at the joint Fraunhofer booth?
Andy Heinig, Head of the Chiplet Center of Excellence:
»The event was an opportunity for a very direct exchange of ideas. The keynote speeches on chiplet design methodology, packaging options, and their costs and performance showed how we can link research and industrial requirements. This was a particularly valuable opportunity for networking, allowing us to obtain feedback on our solutions, answer specific questions, and discuss the challenges that users face in practice. Thanks to these conversations, we can make our work even more relevant to practical applications.«

What inspiration did you gain for future work?
Dr. Benjamin Prautsch, Group Manager Mixed-Signal Automation:
»The exhibition gave us lots of ideas for further developing our projects. The feedback on STCO and APECS was particularly helpful, highlighting aspects that are important to users in industry and research – such as cost-effectiveness, integration variants, and reliability. We’ll use these insights to further improve the practicality of our solutions.«

embedded world 2026 provided valuable insights into current trends as well as an opportunity for face-to-face discussions with industry partners. The booth event on chiplet technologies enriched our dialog with customers and partners and paved the way for future collaborations.