Webinar / December 07, 2022, 4:00 - 5:00 PM (CET)
Based on the state of the art of integration technologies, our webinar shows possible integration approaches for chiplet-based multi-die systems to build future ECU architecture e.g. for ADAS application. Furthermore, we discuss current and future chip to chip standards and their advantages and disadvantages for automotive applications.
Webinar language: English