With the increasing complexity and growing integration density of circuits, the electro-thermal interactions are also intensifying. The use of innovative packaging technologies and new substrates additionally contribute to an increasing power density.
It is therefore more and more difficult for designers to take into account all aspects and conditions during design and avoid negative physical effects. The possible consequences are expensive redesigns and product failures in the field.
With our software tool HeatVision, you maintain a firm perspective on the chip temperature and heat propagation in your system.