Webinar  /  April 15, 2026, 15.00 - 16.00 Uhr

Webinar content

The increasing complexity and cost sensitivity of modern semiconductor components pose significant challenges for the industry. In this webinar, you will learn how innovative chiplet approaches and heterogeneous integration technologies lay the foundation for cutting-edge solutions. We will demonstrate how new design methodologies enable the combination of different design domains across technological options to meet both economic and performance requirements. You will discover how to ensure that your heterogeneous system accounts for all relevant effects, adheres to target cost figures, and maximizes performance. This webinar provides practical insights into optimizing complex systems and informs you about strategies to successfully tackle technological and economic challenges.

Speaker: Dr.-Ing. Benjamin Prautsch, group lead Mixed-Signal Automation