Microelectronics continues to be the driver of innovation and productivity; however, fewer and fewer microelectronics products are manufactured in Europe. To counter this trend and to ensure market success in the future, innovative technologies have to be developed in Europe. This includes Tactile Intelligent Systems (TIS), for which embedded systems are of vital importance. They perform many different tasks related to monitoring, control and data processing in areas such as industrial automation, medical technology and transport. This market segment, which is traditionally strong in Europe, is increasingly being confronted with the challenge of integration with the internet.
By developing the technologies required for TIS, the European leading role in the area of systems expertise can be maintained and new markets can be reached. For TIS, the crucial elements are wireless real-time communication, high data rates, low energy consumption, highest reliability and availability. The MARS project focuses on the development of ultra-low power technologies and optimum deployment of 3D integration in system development.
The work of the Fraunhofer IIS/EAS aims to safeguard the overall reliability of the innovative semiconductor technologies on the level of components and switches. To do this, new modeling and simulation approaches have to be developed to enable the analysis and especially the forecast of degradation effects over a period of years. As part of this project, the researchers of the Fraunhofer IIS/EAS are also further developing their methods for the 3D integration of heterogeneous components. Such innovative chip stacks enable a new type of memory system, among other things, which can handle the huge amounts of data that are generated, such as in autonomous driving, for example.
Project status: completed