Project ZuverSichT

The ZuverSichT project (a German acronym for »Reliable Saxon GaN Technologies«) is a joint research initiative involving companies and research institutions in Saxony. It aims to develop the next generation of semiconductor technologies based on gallium nitride (GaN) for industrial applications. GaN enables energy-efficient, high-performance, and compact electronic systems, such as those used in electromobility, renewable energy, and IoT applications. In this way, the project helps to further the sustainable transformation of industry and society.

Project objectives

ZuverSichT aims to improve the reliability and design support of GaN-based semiconductor technologies as well as their industrial maturity. To this end, the project is developing test structures to detect degradation mechanisms such as electromigration and dielectric breakdown during production. It also applies X-ray techniques for nondestructive analysis.

The results are incorporated into lifetime models and design rules, which are integrated into the process design kit (PDK) to support IC designers. Linking the testing, reliability, and production data lays the foundation for improved process control and forecasting, as well as higher quality and longer service life for GaN products. Validation is done using a demonstrator IC and forms the basis for industrial use.

Finding the solution

The project takes an interdisciplinary approach that combines test structures, analytics, and modeling. Innovative structures with local heating elements enable the detection of degradation mechanisms such as electromigration or time-dependent dielectric breakdown (TDDB) during production. In addition, X-ray microscopy provides nondestructive, high-resolution analysis.

The results are incorporated into lifetime models and design rules and integrated into X-FAB’s process design kit (PDK).

Fraunhofer IIS, specifically its Engineering of Adaptive Systems EAS division, is developing methods and models to support the design and reliability of GaN circuits (in keeping with the »design for reliability«, or DfR, approach). This includes thermal simulations and reliability models for front-end-of-line (FEOL) processes, integration into the PDK, and the development and analysis of heater structures and suitable measurement methods for qualification.

Project partners: Fraunhofer IIS, Engineering of Adaptive Systems EAS division, Fraunhofer IKTS, Fraunhofer IWS, X-FAB Dresden GmbH & Co. KG, AXO Dresden GmbH, wiatec GmbH, EDC Engineering GmbH

Funding period: August 15, 2025 – December 31, 2027