Webinar / June 28, 2023, 4:00 - 5:00 PM (CEST)
Based on the current state of integration technologies, our webinar shows possible integration approaches for chiplet-based multi-die systems to build future sensor fusion platforms, e.g. for ADAS and AGV applications. Furthermore, we discuss current and future chip-to-chip standards and their advantages and disadvantages for automotive and AGV applications.
Webinar language: English