Newsletter 01/2017

From June 19 to 22, 2017, the global electronics design community will meet again at the Design Automation Conference (DAC) in Austin, Texas. At this leading event for the design of electronic circuits and systems, Fraunhofer IIS/EAS will be presenting its comprehensive portfolio of system development support in modern semiconductor technologies. On the one hand, the focus is on tools and services for the design with a focus on functional safety and application-specific reliability. On the other hand, innovative IPs and approaches to system integration provide companies with new impetus for their development work.

chip design
© Inok /
chip design

Fraunhofer IIS/EAS supports the industry with everything related to system design, especially in the use of leading-edge manufacturing technologies and system architectures. Tools and customized solutions open up new possibilities for safely and efficiently designing robust and reliable systems. From its range of services, the institute will present its future-oriented products for efficient system integration all the way to 3D integration at the DAC 2017. To this end, the researchers support the design process from concept development through to implementation and prototype creation. This includes the customer-specific determination of the most suitable integration technology and the assurance for the necessary robustness by simulating thermal, electrical and mechanical effects for complex package solutions.

In addition, the researchers are presenting their services for the development of customer-specific mixed-signal circuits in micro- and ultra-deep submicron technologies right up to series production. For this purpose, EAS also uses its own "intelligent IPs", which ensure a high level of design automation and reusability, even when the manufacturer or the technology node is changed. Tools and services for a design that is optimized for reliability and functional safety round off the Fraunhofer IIS/EAS portfolio. Depending on the application requirements, the institute supports the co-design of hardware and software, for example, or the verification of security and reliability aspects.