Welcome to the Design Automation Division EAS of Fraunhofer IIS. We develop tools and methods for the design of increasingly complex microelectronic and mechatronic systems. As a partner to industry, we produce system solutions for a wide range of fields and applications.


Our new newsletter

The current issue gives you insight into our research work again. Among others, we are part in a project with the goal of a pilot line for "More-than-Moore technologies" in Dresden. Another project is researching the optimization of latency for real-time communication in distributed sensor actuator systems.

Fraunhofer IIS/EAS Technology Day on September 29th, 2015

Fraunhofer IIS/EAS invites representatives of manufacturing industries to the Technology Day »Innovation Potential for Production«. The focus lies on current developments in the areas of »data analysis for quality assurance and maintenance« and »wirelessly networked automation«.

Spin-off from Fraunhofer IIS/EAS offers software for the development of ultra-modern electronics

COSEDA Technologies GmbH in Dresden began its business activities in July 2015. The team consisting of former employees of the Fraunhofer research institute IIS/EAS now offers software that companies around the world can use to develop particularly complex electronic products more reliably, more quickly and more cost-effectively. The company can rely on the know-how accumulated during more than 15 years of cooperation by Fraunhofer IIS/EAS with the semiconductor industry.

Current Events

DAC from June 5 to 9, 2016

Design Automation Conference (DAC) is recognized as the world's premier event for the design of electronic circuits and systems. Fraunhofer IIS/EAS informs about its current offerings of design methodology in the subject automotive reliability and functional safety, and degradation-aware design.



Fraunhofer Institute for Integrated Circuits IIS

Design Automation Division EAS

Zeunerstrasse 38
01069 Dresden
Phone +49 351 4640-701


COSIDE by Fraunhofer IIS/EAS is the tool to develop innovative electronic or heterogeneous. This software tool is the first SystemC/SystemC AMS based commercial design environment to model and simulate higly complex heteroneous systems.

System Integration

With the increasing functionality of electronic systems and the need for increasing miniaturization, the traditional integration of all functions on a single chip (SoC) encounters technological and commercial limitations. One solution is the integration of multiple chips in a single housing from SIP to 3D.

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