Robust ICs with SubVision

Due to the advancing miniaturization of technology nodes and the increasing of carrier frequencies, electrodynamic substrate coupling is ever more common in integrated circuits. The rising density of interconnects increases the possibility of crosstalk or noise. The consequence is a reduced transmission rate or complete failure of the circuit.

With our tool SubVision, designers receive the ability to quickly analyze the electrical potential and field distribution throughout the entire chip and identify electrodynamic error sources at an early stage.