Press Release

May 18, 2016

EDATechForce, LLC - Named Exclusive Distributor for the EAS Division of the Fraunhofer Institute for Integrated Circuits IIS.

The Division “Engineering of Adaptive Systems” of the German Fraunhofer Institute for Integrated Circuits (Fraunhofer IIS/EAS) is now offering its Electronic Design Automation (EDA) products and design expertise in North America for the first time. The basis for this is an exclusive distribution agreement with EDATechForce – a leading supplier of EDA tools and services sales, based in Sunnyvale, California.

Fraunhofer IIS/EAS products include tools and services related to the first SystemC/SystemC AMS design environment for comprehensive hardware/software co-design, one of the most advanced analog design flows available as well as reliability and thermal analysis tools. In addition, Fraunhofer IIS/EAS design services for 3D packaging and services for the automotive electronic product development is now available to North American IC designers, system architects, quality and reliability engineers who are responsible for the solution of complex design problems. The Fraunhofer institute will provide first line technical support and EDATechForce will make the following list of Fraunhofer products and services available to customers:

System Level Design Services
Comprehensive support for all aspects of heterogeneous system design including concept engineering, custom model development, simulation and verification combined with extensive knowledge of VHDL and Verilog (including AMS extensions), SystemC and SystemC AMS

Degradation Analysis
Mastery of effects such as process variations or aging occurring in modern chip structures in micro-technology and nanotechnology

Software tool for the quick analysis of mixed signal designs in order to have the complete control of a design's thermal conditions

Intelligent IP - IIP
An exciting new analog IP generator which has been used internally at Fraunhofer for many years and is now going to be made available to North American customers.

System Integration with Interposers
Design services and optimization support for various advanced packaging technologies from system-in-package (SIP) to 3D integration

Wireless Communication in Critical Environments
Analysis of radio wave propagation and optimization of wireless node locations for applications like clean rooms and process chambers

Optical Sensor Systems
Optical sensor systems for electronic image acquisition and processing by means of laser-light sheet measurements


“As one of Europe’s leading applied research institutions in the field of design automation, we are looking back on more than 20 years of successful cooperation with the semiconductor industry. The next logical step is to offer our advanced solutions not only to European enterprises but also in the main EDA market – North America,” points out Dr. Peter Schneider, division director of Fraunhofer IIS/EAS. “We are convinced that the agreement with our highly experienced new partner EDATechForce is the ideal way to allow our American customers to profit from our solutions and expertise.”

“We have spent years searching for new technologies and an extraordinarily experienced partner like Fraunhofer IIS/EAS. Fraunhofer IIS/EAS will help us meet the demands of our growing list of North American advanced chip and system design customers,” says EDATechForce President and CEO, Carl DeSalvo. “With years of hands-on design experience, a robust suite of new in-demand design tools and IP, the EAS division is the ‘best of the best’ – the ideal partner to help our customers bring even their most complex designs to market quickly –  with the highest levels of reliability.”

Together Fraunhofer IIS/EAS and EDATechForce will present a selection of these products during the 53rd Design Automation Conference taking place in Austin from June 6 to 8, 2016.