Integration of Electronic Systems

Our Services

Reifendrucksensor
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Tire pressure sensor

We accompany and support you in your projects about advanced packaging technologies from its conception up to the prototype. We offer you:

  • Selection of application-specific integration technology
  • Design assistance from concept to implementation
  • Studies to estimate cost and performance
  • Interposer design
  • 3D floorplanning
  • Modeling multi-physical effects (e.g., heat dissipation)
  • Planning and organizing the prototype production at our partners

Project Example: Memory³

In the project Memory³, Fraunhofer IIS/EAS' researchers develop a 3D microchip packaging for 4K high-performance video cameras. They place the processor and the memory chip on one layer (interposer) in the same package.

Compared to conventional chips, this solution has numerous advantages from high miniaturization, short connections and an effective heat-removal. By that data rates of up to 400 Gbit/s shall be achieved.

Memory³ chip design for very high rates in data transmission

Memory³ chip design for very high rates in data transmission

Heat removal in Memory³ chip

Heat removal in Memory³ chip

References

We have developed our know-how in the following projects, for example

  • ESiMED: The project seeks to simplify access to the system-in-package technology for medical engineering.
  • Memory³: The partners are pursuing an especially small and energy-efficient microchip layout for inexpensive and high-performance 4K cameras
  • 3DIM3 (completed project): The European partners developed approaches for 3D-TSV technology (TSV = Through Silicon Via) in particular to allow this innovative technology to be employed effectively.
  • eBrains (completed project): e-BRAINS partners developed innovative applications for all aspects of life based on nanoscale sensor systems.
  • NEEDS (completed project): The partners worked on new design methods to optimize 3D chips with regard to costs and performance even before manufacturing .