Integration of Electronic Systems

Benefits for Our Customers

System-in-Package-Chipaufbau

System-in-package chip

  • Higher performance and reduced energy consumption
  • Size and cost advantages with enhanced functionality
  • Reduced risk when introducing 3D integration technologies due to the Fraunhofer team's more than 10 years of experience.
  • Central point of contact starting from the system design, the design up to prototype production at our partners

Wireless ECG Sensor in SiP Technology

The video shows the animation of a wireless ECG sensor, which was developed with our support, in size comparison.